公开(公告)号：US10141631B2

公开(公告)日：2018-11-27

申请号：US14966446

申请日：2015-12-11

Applicant: Apple Inc.

Inventor： Francesco Merli ,  Yi Jiang ,  Boon W. Shiu ,  Carlo Di Nallo ,  Javier Gomez Tagle ,  Mattia Pascolini

IPC: H01Q1/22 ,  H01Q9/04 ,  H04R1/02 ,  H01Q1/24 ,  H01Q1/44 ,  H01Q9/42

Abstract: An electronic device may be provided with wireless circuitry. The wireless circuitry may include an antenna. The electronic device may have a housing in which control circuitry and radio-frequency transceiver circuitry is mounted. The transceiver circuitry may be used to transmit and receive radio-frequency signals with the antenna. The housing may have a housing wall with a locally thinned portion aligned with the antenna. The antenna may have a sheet metal layer attached to a plastic cavity with a layer of adhesive. Recesses in a printed circuit may receive prongs formed from a sheet metal layer. The plastic carrier may have cavities separated by ribs. The sheet metal layer may form a planar inverted-F antenna resonating element, a ground plane, a return path between the resonating element and ground plane, and a feed path that extends along one of the ribs and into an opening in the printed circuit.

公开(公告)号：US20170170545A1

公开(公告)日：2017-06-15

申请号：US14966446

申请日：2015-12-11

Applicant: Apple Inc.

Inventor： Francesco Merli ,  Yi Jiang ,  Boon W. Shiu ,  Carlo Di Nallo ,  Javier Gomez Tagle ,  Mattia Pascolini

IPC: H01Q1/22 ,  H04R1/02 ,  H01Q9/04

CPC classification number: H01Q1/2291 ,  H01Q1/243 ,  H01Q1/44 ,  H01Q9/0421 ,  H01Q9/0457 ,  H01Q9/42 ,  H04R1/02

Abstract: An electronic device may be provided with wireless circuitry. The wireless circuitry may include an antenna. The electronic device may have a housing in which control circuitry and radio-frequency transceiver circuitry is mounted. The transceiver circuitry may be used to transmit and receive radio-frequency signals with the antenna. The housing may have a housing wall with a locally thinned portion aligned with the antenna. The antenna may have a sheet metal layer attached to a plastic cavity with a layer of adhesive. Recesses in a printed circuit may receive prongs formed from a sheet metal layer. The plastic carrier may have cavities separated by ribs. The sheet metal layer may form a planar inverted-F antenna resonating element, a ground plane, a return path between the resonating element and ground plane, and a feed path that extends along one of the ribs and into an opening in the printed circuit.