公开(公告)号：US20170001427A1

公开(公告)日：2017-01-05

申请号：US14790932

申请日：2015-07-02

Applicant: Apple Inc.

Inventor： James R. Krogdahl ,  George Kyle Lobisser ,  Justin R. Wodrich

IPC: B32B38/10 ,  B32B37/12 ,  B32B37/06

CPC classification number: F16B11/006 ,  G06F1/1613 ,  H04M1/0202 ,  H04M1/0249

Abstract: An electronic device may include electronic device structures that are attached with a moisture and light curable adhesive. To assemble the electronic device, adhesive may be dispensed onto a first electronic device structure. An attachment structure may then be used to attach a second electronic device structure to the first electronic device structure. The electronic device may be tested with testing equipment. If the electronic device needs to be reworked, a separation tool may be used to separate the first and second electronic device structures. After separating the structures, residual moisture and light curable adhesive on the structures may be exposed to light to ensure that the moisture and light curable adhesive is fully cured. The moisture and light curable adhesive may then be removed without leaving any residue on the electronic device housing structures. The electronic device structures may include an electronic device housing and a cover glass.

Abstract translation: 电子设备可以包括用湿气和光可固化粘合剂附着的电子设备结构。 为了组装电子设备，可以将粘合剂分配到第一电子设备结构上。 然后可以使用附接结构来将第二电子设备结构附接到第一电子设备结构。 电子设备可以用测试设备进行测试。 如果电子设备需要重新加工，则可以使用分离工具来分离第一和第二电子设备结构。 在分离结构之后，结构上的残留水分和可光固化粘合剂可能暴露于光下，以确保湿气和光固化粘合剂完全固化。 然后可以除去水分和光固化粘合剂，而不会在电子器件外壳结构上留下任何残留物。 电子设备结构可以包括电子设备外壳和盖玻璃。