ETCHING FOR BONDING POLYMER MATERIAL TO ANODIZED METAL

    公开(公告)号:US20190098780A1

    公开(公告)日:2019-03-28

    申请号:US16125352

    申请日:2018-09-07

    Applicant: Apple Inc.

    Abstract: This application relates to a multi-piece enclosure for a portable electronic device. The enclosure includes a metal part including a metal substrate and a metal oxide layer overlaying the metal substrate, the metal oxide layer having an external surface that includes openings that lead into undercut regions. The openings are characterized as having a first width, and the undercut regions are characterized as having a second width that is greater than the first width. The enclosure further includes a non-metallic bulk layer including protruding portions that extend into the undercut regions such that the non-metallic bulk layer is interlocked with the metal part.

    TITANIUM PART HAVING AN ETCHED SURFACE

    公开(公告)号:US20210010151A1

    公开(公告)日:2021-01-14

    申请号:US16867200

    申请日:2020-05-05

    Applicant: Apple Inc.

    Abstract: This application relates to a part for a portable electronic device. The part includes a titanium alloy substrate including a network of branching channels. The branching channels include a first channel and a second channel, where the first channel is defined by a first channel wall that extends away from a first opening in the exterior surface, and the second channel is defined by a second channel wall that extends away from a second opening in the first channel wall.

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