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公开(公告)号:US20230088604A1
公开(公告)日:2023-03-23
申请号:US17878321
申请日:2022-08-01
Applicant: Apple Inc.
Inventor: Brian J. Haskins , Jamie N. Forslin , Liang Guo , Jian Wang
IPC: H01M50/581 , H01M50/218 , H01M50/507
Abstract: The disclosed technology relates to a busbar and thermal cut-off device (TCO) sub-assembly. The sub-assembly may be configured to be connected to a first battery cell and a second battery cell. The sub-assembly may comprise a first busbar configured to electrically connect the first battery cell to the second battery cell when the sub-assembly is connected to the first battery cell and the second battery cell. The sub-assembly may comprise a first TCO connected directly to the first busbar. The sub-assembly may not extend above a top surface of the first battery cell when the sub-assembly is connected to the first battery cell.