TOUCH SENSOR ARRAYS WITH INTEGRATED INTER-LAYER CONTACTS

    公开(公告)号:US20190155419A1

    公开(公告)日:2019-05-23

    申请号:US16251356

    申请日:2019-01-18

    Applicant: Apple Inc.

    Abstract: Touch pad structures are provided that gather touch sensor data. The data may be used to control a computer or other electronic device. The touch pad structures may be integrated into a computer or other computing equipment or may be provided as a stand-alone accessory. The touch pad structures may include a touch sensor array. The touch sensor array may include rows and columns of touch sensor electrodes, interconnect lines, and other conductive structures. The conductive structures on the touch sensor array may be formed from patterned layers of ink. Interconnect line segments in different layer of ink may be connected in rectangular contact regions. The touch sensor array may have a tail. A layer of insulator may be removed from the substrate across a tip portion of the tail to allow the line segments to be connected.

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