公开(公告)号：US11581351B2

公开(公告)日：2023-02-14

申请号：US16935094

申请日：2020-07-21

Applicant: Apple Inc.

Inventor： Aurelien R. Hubert ,  Jee Tung Tan ,  Steven Webster ,  Douglas S. Brodie ,  Qiang Yang ,  Masahito Morita

IPC: H01L27/146 ,  H04N5/225 ,  H04M1/02

Abstract: A hybrid sensor shift platform for an optical image stabilization (OIS) actuator mechanism in compact camera modules includes two or more substrates. A top substrate is composed of an organic material (e.g., a resin) to reduce mass, reduce magnetic interaction with permanent magnets, and improve reliability. One or more lower substrates of the hybrid sensor shift platform are ceramic substrates that provide the benefits of ceramics for connection to the image sensor. The organic substrate is connected via a solder bond process to the lower ceramic substrate(s). The connection between the substrates is reinforced with an under-fill of epoxy that surrounds the solder bonds, thus creating a full interface between the substrates within the overlap.

公开(公告)号：US20210028216A1

公开(公告)日：2021-01-28

申请号：US16935094

申请日：2020-07-21

Applicant: Apple Inc.

Inventor： Aurelien R. Hubert ,  Jee Tung Tan ,  Steven Webster ,  Douglas S. Brodie ,  Qiang Yang ,  Masahito Morita

IPC: H01L27/146 ,  H04M1/02 ,  H04N5/225

Abstract: A hybrid sensor shift platform for an optical image stabilization (OIS) actuator mechanism in compact camera modules includes two or more substrates. A top substrate is composed of an organic material (e.g., a resin) to reduce mass, reduce magnetic interaction with permanent magnets, and improve reliability. One or more lower substrates of the hybrid sensor shift platform are ceramic substrates that provide the benefits of ceramics for connection to the image sensor. The organic substrate is connected via a solder bond process to the lower ceramic substrate(s). The connection between the substrates is reinforced with an under-fill of epoxy that surrounds the solder bonds, thus creating a full interface between the substrates within the overlap.