公开(公告)号：US10807766B2

公开(公告)日：2020-10-20

申请号：US16354730

申请日：2019-03-15

Applicant: Apple Inc.

Inventor： Mark T. Uyeda ,  Katherine O. Krajewski

IPC: B65D23/14 ,  G06K7/10 ,  H01Q1/22 ,  B65D79/00

Abstract: A product with packaging includes an envelope having a cavity. An NFC chip may be embedded in the packaging. The NFC chip may be passive, and may connect to the electronic device of the specific user, and once connected may initiate or carry out an authentication process or activation process.

公开(公告)号：US11447297B2

公开(公告)日：2022-09-20

申请号：US17022339

申请日：2020-09-16

Applicant: Apple Inc.

Inventor： Mark T. Uyeda ,  Katherine O. Krajewski

IPC: B65D23/14 ,  B65D79/00 ,  G06K7/10 ,  H01Q1/22

Abstract: A product with packaging includes an envelope having a cavity. An NFC chip may be embedded in the packaging. The NFC chip may be passive, and may connect to the electronic device of the specific user, and once connected may initiate or carry out an authentication process or activation process.

公开(公告)号：US20200290769A1

公开(公告)日：2020-09-17

申请号：US16354730

申请日：2019-03-15

Applicant: Apple Inc.

Inventor： Mark T. Uyeda ,  Katherine O. Krajewski

IPC: B65D23/14 ,  B65D79/00 ,  H01Q1/22 ,  G06K7/10

Abstract: A product with packaging includes an envelope having a cavity. An NFC chip may be embedded in the packaging. The NFC chip may be passive, and may connect to the electronic device of the specific user, and once connected may initiate or carry out an authentication process or activation process.