公开(公告)号：US20210298212A1

公开(公告)日：2021-09-23

申请号：US17033477

申请日：2020-09-25

Applicant: Apple Inc.

Inventor： Kevin K. MAYER ,  Alex Chun Lap YEUNG ,  Chunwei YU ,  Judith C. SEGURA ,  Lee B. HAMSTRA ,  John V. ABRAM

IPC: H05K9/00 ,  H05K7/20

Abstract: An electronic device that includes a circuit board and a shield designed to cover the circuit board is disclosed. The shield can provide radio frequency shielding, thermal energy dissipation, and desense mitigation. The shield provides added structural benefits. For example, the thermal assembly can be made with a non-metal material, such as graphite. Further, the thermally assembly may include multiple graphite layers secured by adhesive layers. Additionally, the shield can rely upon adhesives/tapes to adhere to a metal wall located on a perimeter of the circuit board. In this manner, the shield can provide a compliant body that conforms to the position and location of the metal wall, account for tolerance variations in the metal wall, and thus prevent bending of the metal wall, as opposed to using rigid metal bodies. Based on the adhesive properties, the shield requires no holes for fasteners.