公开(公告)号：US11740691B1

公开(公告)日：2023-08-29

申请号：US17228588

申请日：2021-04-12

Applicant: Apple Inc.

Inventor： Muhammad F. Hossain ,  Nicholas C. Soldner ,  Hong Pan ,  Seth E. Woiszwillo ,  Anthony Y. Fai

IPC: G06F3/01 ,  G06F1/16 ,  G01C19/5783

CPC classification number: G06F3/012 ,  G01C19/5783 ,  G06F1/163

Abstract: A head-mountable device can securely support sensors in a manner that maintains their positions and orientations over time and avoids applying excessive strain on the sensors, thereby protecting them from harm. The sensor can be mounted on a flex circuit or circuit board, which is rigidly secured within an inner case, including for example a base and an inner shield. The inner case can be suspended within an outer case, including for example a frame and an outer shield. Shock absorbers on opposing sides of the inner case can flexibly couple the inner case to the outer case. The shock absorbers can dampen the effects of vibrations or other forces applied from the outer case. The inner case can decouple the sensor from strain applied from the shock absorbers.