公开(公告)号：US20220091685A1

公开(公告)日：2022-03-24

申请号：US17031549

申请日：2020-09-24

Applicant: Apple Inc.

Inventor： Daniel Jacob Benjamin BECHSTEIN ,  John Stephen SMITH ,  Siddharth SHEKAR ,  Teera SONGATIKAMAS ,  Elvis Mwenda KIBITI ,  Jared A. BRAUNER ,  Lindsay Diane Rego CORBET ,  Wang Chung Alston CHEUNG ,  Vipin AYANOOR-VITIKKATE ,  Nitin SITARAMAN ,  Joyan Gratian SANCTIS ,  Blake R. MARSHALL

IPC: G06F3/0354 ,  G06F3/044 ,  G06F3/038

Abstract: In some examples, a stylus can include a conductive shield. In some examples, the conductive shield can include a plurality of traces along an edge of a printed circuit board (PCB) including the stylus circuitry. In some examples, the conductive shield can include a shield can coupled to the PCB and disposed around the components of the stylus circuitry. In some examples, the conductive shield can include a hollow portion into which the stylus circuitry can be disposed and a solid portion that can act as a reference electrode. In some examples, the conductive shield can include a hollow sleeve disposed around the stylus circuitry. In some examples, the conductive sleeve can be attached to the PCB. In some examples, the conductive sleeve can be disposed between layers of a housing of the stylus. In some examples, the conductive sleeve can be integrated with the stylus housing.