公开(公告)号：US20240205315A1

公开(公告)日：2024-06-20

申请号：US18085442

申请日：2022-12-20

Applicant: Apple Inc.

Inventor： Benjamin J. Pope ,  Wing Shan Wong

IPC: H04M1/02

CPC classification number: H04M1/0249 ,  H04M1/0262 ,  H04M1/0264 ,  H04M1/0274

Abstract: A mobile phone may include a housing structure defining a peripheral wall and a front cover formed of glass and coupled to the housing structure and defining at least a portion of a front exterior surface of the mobile phone. The mobile phone may further include a display below the front cover, a circuit board assembly coupled to the housing structure, and a removable rear cover assembly coupled to the housing structure and including a rear cover formed of glass, a rear-facing camera window, a charging coil coupled to the rear cover and configured to wirelessly receive power for charging the mobile phone, and an electrical connector conductively coupling the rear cover assembly to the circuit board assembly. The mobile phone may further include a supplemental housing component configured to be coupled to the housing structure in place of the removable rear cover assembly.

公开(公告)号：US20250004502A1

公开(公告)日：2025-01-02

申请号：US18746824

申请日：2024-06-18

Applicant: Apple Inc.

Inventor： Li-Tyng Hung ,  Maegan K. Spencer ,  Albert Wang ,  Salome Bavetta ,  Lindsay M. Epstein ,  Wing Shan Wong ,  Wegene H. Tadele ,  Michael A. Kinney ,  Aaron N. Miletich

IPC: G06F1/16

Abstract: Embodiments are directed to wearable electronic devices including a band having a flexible layer and a routing layer coupled to the flexible layer. The routing layer including one or more electrical traces. A first enclosure is coupled to the band at a first opening and includes a first upper enclosure segment coupled to a first side of the band and a first lower enclosure segment coupled to a second side of the band. A processing unit is enclosed within the first enclosure and electrically coupled to the routing layer. A second enclosure is coupled to the band at a second opening and includes a second upper enclosure segment coupled to the first side of the band and a second lower enclosure segment coupled to the second side of the band. A battery is enclosed within the second enclosure and electrically coupled to the processing unit via the routing layer.