公开(公告)号：US20230142264A1

公开(公告)日：2023-05-11

申请号：US17899117

申请日：2022-08-30

Applicant: Apple Inc.

Inventor： Alex J. Lehmann ,  Joonas I. Ponkala ,  Keith J. Hendren ,  Xian Wang ,  Yu-Lin Kao ,  Kevin C. Armendariz

IPC: G06F3/01 ,  G06F3/041 ,  G06F3/02

CPC classification number: G06F3/016 ,  G06F3/0414 ,  G06F3/0202 ,  G06F3/0447

Abstract: Embodiments are directed to an electronic device that includes a cover and a haptic module positioned below the cover. The haptic module includes a substrate positioned below the cover and offset from the cover, a spacer positioned between the substrate and the cover and coupling the substrate to the cover, and a piezoelectric element positioned on a surface of the substrate and offset from the cover to define a gap between the piezoelectric element and the cover. The electronic device can also include a sensor coupled to the cover and configured to detect an input, and a processing unit operably coupled to the piezoelectric element and configured to cause the piezoelectric element to deflect the cover in response to the sensor detecting the input.