公开(公告)号：US20240142684A1

公开(公告)日：2024-05-02

申请号：US18487004

申请日：2023-10-13

Applicant: Apple Inc.

Inventor： Bin Fan ,  Brian S. Tryon ,  Xiaofan Niu ,  Chia-Yeh Lee ,  Frank C. Sit ,  Hien Minh H Le ,  Justin S. Shi ,  Shinjita Acharya ,  Ziqing Duan

IPC: G02B5/28 ,  A61B5/263 ,  A61B5/28 ,  A61B5/318

CPC classification number: G02B5/286 ,  A61B5/263 ,  A61B5/28 ,  A61B5/318 ,  A61B5/742

Abstract: An electronic device such as a wristwatch may be provided with conductive structures. The conductive structures may include a sensor electrode for an electrocardiogram (ECG) sensor. A coating may be disposed on the sensor electrode to reflect particular wavelengths of visible light so that the sensor electrode exhibits a desired color. The coating may include adhesion and transition layers on the sensor electrode, an opaque coloring layer on the adhesion and transition layers, and a thin-film interference filter on the opaque coloring layer. The thin-film interference filter may have an uppermost diamond-like carbon (DLC) layer. The DLC layer may contribute to the color response of the coating while concurrently minimizing noise in ECG waveforms gathered by the ECG sensor using the sensor electrode.

公开(公告)号：US20250085463A1

公开(公告)日：2025-03-13

申请号：US18523605

申请日：2023-11-29

Applicant: Apple Inc.

Inventor： Brian S Tryon ,  Jozef M Matlak ,  Ziqing Duan ,  Yi Zhou ,  Di Fan ,  Donghai Yu

IPC: G02B5/28

Abstract: An electronic device may be provided with conductive structures such as conductive housing structures. A visible-light-reflecting coating may be formed on the conductive structures. The coating may have adhesion and transition layers, an opaque coloring layer on the adhesion and transition layers, and a two-layer thin-film interference filter on the opaque coloring layer. The two-layer thin-film interference filter may an uppermost diamond-like carbon (DLC) or CrSiCN layer and a lowermost SiCrCN layer. The coating may exhibit a dark blue or black color that has a relatively uniform visual response even when the underlying conductive structures have a three-dimensional shape.