公开(公告)号：US20140021673A1

公开(公告)日：2014-01-23

申请号：US13723516

申请日：2012-12-21

Applicant: Applied Materials, Inc.

Inventor： Xinglong Chen ,  Jang-Gyoo Yang ,  Alex Tam ,  Elisha Tam

IPC: F28D15/00

CPC classification number: H01L21/67103 ,  F28D15/00 ,  H01L21/67109

Abstract: Substrate support assemblies for a semiconductor processing apparatus are described. The assemblies may include a pedestal and a stem coupled with the pedestal. The pedestal may be configured to provide multiple regions having independently controlled temperatures. Each region may include a fluid channel to provide a substantially uniform temperature control within the region, by circulating a temperature controlled fluid that is received from and delivered to internal channels in the stem. The fluid channels may include multiple portions configured in a parallel-reverse flow arrangement. The pedestal may also include fluid purge channels that may be configured to provide thermal isolation between the regions of the pedestal.

Abstract translation: 对半导体处理装置的基板支撑组件进行说明。 组件可以包括底座和与底座联接的杆。 基座可以被配置成提供具有独立控制的温度的多个区域。 每个区域可以包括流体通道，以通过循环从杆中的内部通道接收的温度控制的流体来在区域内提供基本均匀的温度控制。 流体通道可以包括以平行逆流装置构造的多个部分。 基座还可以包括可被配置为在基座的区域之间提供热隔离的流体吹扫通道。