公开(公告)号：US20240109164A1

公开(公告)日：2024-04-04

申请号：US17959076

申请日：2022-10-03

Applicant: Applied Materials, Inc.

Inventor： Chang ZHANG ,  Jian J. CHEN ,  Quoc TRUONG ,  Jamie Stuart LEIGHTON

IPC: B24B49/16 ,  B24B37/30 ,  B24B49/12

CPC classification number: B24B49/16 ,  B24B37/30 ,  B24B49/12

Abstract: A polishing system includes a pressure system, a substrate carrier including a membrane, a first sensor, and a control system. A first compartment of the membrane is fluidly coupled to the pressure system. The first sensor is configured to monitor the pressure system and produce a first output based on conditions detected in the pressure system. The control system coupled to the first sensor and configured to process the first output to produce a first processed output, and the control system configured to compare the first processed output to a threshold to detect a presence of a fluid in the pressure system.