SHIELD FOR A SUBSTRATE PROCESSING CHAMBER
    2.
    发明申请

    公开(公告)号:US20190267220A1

    公开(公告)日:2019-08-29

    申请号:US16409757

    申请日:2019-05-10

    Abstract: A shield encircles a sputtering target that faces a substrate support in a substrate processing chamber. The shield comprises an outer band having a diameter sized to encircle the sputtering target, the outer band having upper and bottom ends, and the upper end having a tapered surface extending radially outwardly and adjacent to the sputtering target. A base plate extends radially inward from the bottom end of the outer band. An inner band joined to the base plate at least partially surrounds a peripheral edge of a substrate support. The shield can also have a heat exchanger comprising a conduit with an inlet and outlet to flow heat exchange fluid therethrough.

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