公开(公告)号：US20230153503A1

公开(公告)日：2023-05-18

申请号：US18099130

申请日：2023-01-19

Applicant: Applied Materials, Inc.

Inventor： Stephen Moffatt ,  SHELDON R. NORMAND ,  DERMOT P. CANTWELL

IPC: G06F30/367 ,  H01L21/66 ,  G06F30/398

CPC classification number: G06F30/367 ,  H01L22/20 ,  G06F30/398

Abstract: Embodiments disclosed herein include a semiconductor manufacturing tool with a hybrid model and methods of using the hybrid model for processing wafers and/or developing process recipes. In an embodiment, a method for developing a semiconductor manufacturing process recipe comprises selecting one or more device outcomes, and querying a hybrid model to obtain a process recipe recommendation suitable for obtaining the device outcomes. In an embodiment, the hybrid process model comprises a statistical model and a physical model. In an embodiment, the method may further comprise executing a design of experiment (DoE) on a set of wafers to validate the process recipe recommended by the hybrid process model.