公开(公告)号：US20250019824A1

公开(公告)日：2025-01-16

申请号：US18717165

申请日：2021-12-06

Applicant: Applied Materials, Inc.

Inventor： Jong Yun Kim ,  William Nehrer ,  Sang Jeong Oh ,  Han Byoul Kim

IPC: C23C16/44 ,  C23C16/455 ,  C23C16/505

Abstract: Exemplary substrate processing chambers may include a chamber body defining a processing region. The chambers may include a backing plate disposed atop the chamber body, a diffuser above the processing region and supported by the backing plate, and a cooling frame disposed between the backing plate and the diffuser. The cooling frame may be coupled with the diffuser. The cooling frame may include a body having one or more fluid inlets and one or more fluid outlets. The body may define an opening. The fluid inlets may be in fluid communication with the one or more fluid outlets via one or more fluid lumens that each extend at least partially about a periphery of the opening. The fluid inlets may be in fluid communication with one or more fluid supply lumens. The fluid outlets may be in fluid communication with one or more fluid return lumens.