公开(公告)号：US20200173017A1

公开(公告)日：2020-06-04

申请号：US16697472

申请日：2019-11-27

Applicant: Applied Materials, Inc.

Inventor： Chidambara A. RAMALINGAM ,  Juan Carlos ROCHA ,  Joseph M. POLESE ,  Katty Marie Lydia Gamon GUYOMARD ,  Jian LI

IPC: C23C16/458 ,  H01L21/683 ,  H01J37/32

Abstract: Embodiments of the present disclosure generally relate to substrate support assemblies used in semiconductor device manufacturing. In one embodiment, a substrate support includes a ceramic body having at least one aperture formed therein defined by a sidewall. A plurality of recesses extend into the sidewall, a rod member is disposed in the at least one aperture, and an eyelet member is circumferentially disposed about the rod member. The eyelet member has a plurality of protrusions extending outwardly therefrom, each disposed in a corresponding recess of the plurality of recesses. A first portion of each protrusion is in contact with a sidewall of the respective recess of the ceramic body and a second portion of each protrusion is separated by a gap from the sidewall of the respective recess of the ceramic body. A first portion of a brazing material is disposed between an upper surface of the at least one aperture and an end of the rod member.