公开(公告)号：US20140105582A1

公开(公告)日：2014-04-17

申请号：US14042864

申请日：2013-10-01

Applicant: Applied Materials, Inc.

Inventor： SAIRAJU TALLAVARJULA ,  KEVIN JOSEPH BAUTISTA ,  JEFFREY TOBIN

IPC: B23Q3/18 ,  H05B3/00

CPC classification number: B23Q3/18 ,  H01L21/67115 ,  H01L21/6875 ,  H05B3/0038 ,  H05B3/0047

Abstract: Embodiments of edge rings for substrate supports of semiconductor substrate process chambers are provided herein. In some embodiments, an edge ring for a semiconductor process chamber may include an annular body having a central opening, an inner edge, an outer edge, an upper surface, and a lower surface, an inner lip disposed proximate the inner edge and extending downward from the upper surface, and a plurality of protrusions extending upward from the inner lip and disposed along the inner edge of the annular body, wherein the plurality of protrusions are arranged to support a substrate above the inner lip and over the central opening, wherein the inner lip is configured to substantially prevent light radiation from travelling between a first volume disposed above the edge ring and a second volume disposed below the edge ring when a substrate is disposed on the plurality of protrusions.

Abstract translation: 本文提供了用于半导体衬底处理室的衬底支撑件的边缘环的实施例。 在一些实施例中，用于半导体处理室的边缘环可以包括具有中心开口，内边缘，外边缘，上表面和下表面的环形主体，靠近内边缘设置并向下延伸的内唇缘 以及从所述内唇缘向上延伸并且沿着所述环形体的内边缘设置的多个突起，其中所述多个突起被布置成将衬底支撑在所述内唇缘上方且在所述中心开口上方，其中， 内唇被配置为当衬底设置在多个突起上时，基本上防止光辐射在设置在边缘环上方的第一容积和设置在边缘环下方的第二体积之间行进。