公开(公告)号：US12255051B2

公开(公告)日：2025-03-18

申请号：US17983926

申请日：2022-11-09

Applicant: Applied Materials, Inc.

Inventor： Linying Cui ,  James Rogers ,  Daniel Sang Byun ,  Rajinder Dhindsa ,  Keith Hernandez

IPC: H01J37/32

Abstract: Embodiments of the disclosure provided herein include a method for processing a substrate in a plasma processing system. The method includes receiving a first synchronization waveform signal from a controller, delivering a first burst of first voltage pulses to an electrode assembly after receiving a first portion of the first synchronization waveform signal, wherein at least one first parameter of the first voltage pulses is set to a first value based on a first waveform parameter within the first portion of the first synchronization waveform signal, and delivering a second burst of second voltage pulses to the electrode assembly after receiving a second portion of the first synchronization waveform signal, wherein the at least one first parameter of the first voltage pulses is set to a second value based on a difference in the first waveform parameter within the second portion of the first synchronization waveform signal.