公开(公告)号：US20230265554A1

公开(公告)日：2023-08-24

申请号：US18104437

申请日：2023-02-01

Applicant: Applied Materials, Inc.

Inventor： Takashi KURATOMI ,  Ki-Pyo HONG

IPC: C23C14/50 ,  B25B5/16 ,  C23C14/34

CPC classification number: C23C14/50 ,  B25B5/163 ,  C23C14/34

Abstract: An apparatus for processing a semiconductor substrate, such as an optical device, is described herein. The apparatus includes a substrate carrier which is configured to enable a processing chamber configured to process larger substrates to process a smaller substrate without retrofitting the processing chamber. The substrate carrier includes a carrier base and a clamp ring. The carrier base includes a plurality of gas channels formed within a substrate pocket. The clamp ring is disposed on the carrier base and over the substrate and holds the substrate in place. The clamp ring is either weighted or configured to be help by a separate chamber clamping mechanism.