公开(公告)号：US20220035979A1

公开(公告)日：2022-02-03

申请号：US16944012

申请日：2020-07-30

Applicant: Applied Materials, Inc.

Inventor： Stephen Moffatt ,  Sheldon R. Normand ,  Dermot P. Cantwell

IPC: G06F30/367 ,  G06F30/398 ,  H01L21/66

Abstract: Embodiments disclosed herein include a semiconductor manufacturing tool with a hybrid model and methods of using the hybrid model for processing wafers and/or developing process recipes. In an embodiment, a method for developing a semiconductor manufacturing process recipe comprises selecting one or more device outcomes, and querying a hybrid model to obtain a process recipe recommendation suitable for obtaining the device outcomes. In an embodiment, the hybrid process model comprises a statistical model and a physical model. In an embodiment, the method may further comprise executing a design of experiment (DoE) on a set of wafers to validate the process recipe recommended by the hybrid process model.

公开(公告)号：US11947888B2

公开(公告)日：2024-04-02

申请号：US18099130

申请日：2023-01-19

Applicant: Applied Materials, Inc.

Inventor： Stephen Moffatt ,  Sheldon R. Normand ,  Dermot P. Cantwell

IPC: G06F30/367 ,  G06F30/398 ,  H01L21/66

CPC classification number: G06F30/367 ,  G06F30/398 ,  H01L22/20

Abstract: Embodiments disclosed herein include a semiconductor manufacturing tool with a hybrid model and methods of using the hybrid model for processing wafers and/or developing process recipes. In an embodiment, a method for developing a semiconductor manufacturing process recipe comprises selecting one or more device outcomes, and querying a hybrid model to obtain a process recipe recommendation suitable for obtaining the device outcomes. In an embodiment, the hybrid process model comprises a statistical model and a physical model. In an embodiment, the method may further comprise executing a design of experiment (DoE) on a set of wafers to validate the process recipe recommended by the hybrid process model.

公开(公告)号：US11586794B2

公开(公告)日：2023-02-21

申请号：US16944012

申请日：2020-07-30

Applicant: Applied Materials, Inc.

Inventor： Stephen Moffatt ,  Sheldon R. Normand ,  Dermot P. Cantwell

IPC: G06F30/398 ,  G06F30/367 ,  H01L21/66

Abstract: Embodiments disclosed herein include a semiconductor manufacturing tool with a hybrid model and methods of using the hybrid model for processing wafers and/or developing process recipes. In an embodiment, a method for developing a semiconductor manufacturing process recipe comprises selecting one or more device outcomes, and querying a hybrid model to obtain a process recipe recommendation suitable for obtaining the device outcomes. In an embodiment, the hybrid process model comprises a statistical model and a physical model. In an embodiment, the method may further comprise executing a design of experiment (DoE) on a set of wafers to validate the process recipe recommended by the hybrid process model.