公开(公告)号：US09437640B2

公开(公告)日：2016-09-06

申请号：US14481038

申请日：2014-09-09

Applicant: Applied Materials, Inc.

Inventor： Sherry Mings ,  Patricia M. Liu ,  Steven C. H. Hung

IPC: H01L27/14 ,  H01L27/146

CPC classification number: H01L27/14643 ,  H01L27/1462 ,  H01L27/14621 ,  H01L27/14625 ,  H01L27/14627 ,  H01L27/1464 ,  H01L27/14689

Abstract: Backside illuminated sensors and methods of manufacture are described. Specifically, a backside illuminated sensor with a dipole modulating layer near the photodiode is described.

Abstract translation: 描述背面照明传感器和制造方法。 具体来说，描述了在光电二极管附近具有偶极子调制层的背面照明传感器。