公开(公告)号：US20230125502A1

公开(公告)日：2023-04-27

申请号：US17512555

申请日：2021-10-27

Applicant: Applied Materials, Inc.

Inventor： Shiyan JAYANATH ,  Daniel REDFIELD ,  Ashwin CHOCKALINGAM

IPC: B24B37/005 ,  B24B37/04 ,  H01L21/306

Abstract: Embodiments described herein generally relate to a surface topology measurement device that enables mapping a surface profile of a polishing pad. Embodiments of the disclosure may include a method of measuring and/or adjusting a property of a polishing surface of a polishing pad disposed in a substrate processing system during processing or after one or more processes have been performed. The method can include positioning a surface topology measurement device such that the surface topology measurement device contacts the polishing surface of the polishing pad, generating a three-dimensional surface map of the polishing surface of the polishing pad, comparing the three-dimensional surface map of the polishing surface of the polishing pad to a predetermined threshold, and adjusting one or more properties of the substrate processing system based on the comparison of the three-dimensional surface map to the predetermined threshold.