公开(公告)号：US20220336813A1

公开(公告)日：2022-10-20

申请号：US17659302

申请日：2022-04-14

Applicant: Applied Materials, Inc.

Inventor： SUBRAMANYA P. HERLE ,  Gao LIU ,  Jie GUAN ,  James CUSHING ,  Ajey M. JOSHI ,  Tianyu ZHU ,  Chen FANG ,  Thanh-Nhan TRAN

IPC: H01M4/62 ,  H01M4/134 ,  H01M4/133 ,  H01M4/04 ,  C08G73/10

Abstract: Polyimide binders and their polyamic precursors to be used for forming electrode structures are provided. The designed polyamic binder precursors are water-soluble, and the resulting polyimide binders are mechanically strong, electrochemically and thermally stable. The properties of polyimide binders have led to significant improvement in electrode compatibility towards new manufactural processes.