公开(公告)号：US20250133730A1

公开(公告)日：2025-04-24

申请号：US18919189

申请日：2024-10-17

Applicant: Applied Materials, Inc.

Inventor： WanGee Kim ,  Michel Frei ,  Mahendra Pakala ,  Ellie Y. Yieh

IPC: H10B12/00

Abstract: This specification describes technologies for creating and coupling word lines of a 3D memory cell array to corresponding word lines of a word line connect area. One aspect is a method that includes positioning a memory cell array on a substrate adjacent to a word line connect area, the word line connect area comprising a plurality of layers, the plurality of layers alternating between a first material and a second material; replacing at least a portion of the layers of the first material with a third material; and replacing at least a portion of the layers of the second material with a fourth material, wherein the fourth material forms word lines within the word line connect area and is electrically coupled to memory cell word lines within the memory cell array.