公开(公告)号：US20010027080A1

公开(公告)日：2001-10-04

申请号：US09851661

申请日：2001-05-08

Applicant: Applied Materials, Inc., Delaware corporation

Inventor： Andreas Norbert Wiswesser ,  Walter Schoenleber ,  Boguslaw Swedek ,  Manoocher Birang

IPC: B24B049/00 ,  B24B051/00

CPC classification number: B24B49/12 ,  B24B37/013 ,  B24B49/04

Abstract: A chemical mechanical polishing apparatus includes a platen to support a polishing pad, and a polishing head to hold a substrate against the polishing pad during processing. The substrate includes a thin film structure disposed on a wafer. A first optical system includes a first light source to generate a first light beam which impinges on a surface of the substrate, and a first sensor to measure light reflected from the surface of the substrate to generate a measured first interference signal. A second optical system includes a second light source to generate a second light beam which impinges on a surface of the substrate and a second sensor to measure light reflected from the surface of the substrate to generate a measured second interference signal. The second light beam has a wavelength different from the first light beam.

Abstract translation: 化学机械抛光装置包括用于支撑抛光垫的压板和用于在加工期间将衬底保持在抛光垫上的抛光头。 衬底包括设置在晶片上的薄膜结构。 第一光学系统包括产生撞击在基板的表面上的第一光束的第一光源和用于测量从基板的表面反射的光以产生测量的第一干涉信号的第一传感器。 第二光学系统包括第二光源，用于产生入射到衬底的表面上的第二光束;以及第二传感器，用于测量从衬底的表面反射的光，以产生测量的第二干涉信号。 第二光束具有与第一光束不同的波长。