公开(公告)号：US20240193756A1

公开(公告)日：2024-06-13

申请号：US18537693

申请日：2023-12-12

Applicant: Applied Materials Israel Ltd.

Inventor： Lior AKERMAN ,  Tomer Haim PELED

IPC: G06T7/00 ,  G06T7/11

CPC classification number: G06T7/0006 ,  G06T7/11 ,  G06T2207/10061 ,  G06T2207/20081 ,  G06T2207/30148

Abstract: There is provided a method and a system in which a processing circuitry is configured to obtain an inspection image representative of 2D information of an inspection area of a semiconductor specimen, and feed the inspection image to a trained machine learning model operative to segment the inspection image into at least a first segment S′1 and a second segment S′2, wherein the first segment S′1 corresponds to a first region of the inspection area which has a height profile pattern corresponding to a first height profile pattern, and the second segment S′2 corresponds to a second region of the area which has a height profile pattern corresponding to a second height profile pattern, wherein the first height profile pattern is different from the second height profile pattern.