SHAPE LOCALIZATION FOR EXAMINING A SEMICONDUCTOR SPECIMEN

    公开(公告)号:US20240046445A1

    公开(公告)日:2024-02-08

    申请号:US17880535

    申请日:2022-08-03

    CPC classification number: G06T7/001 G06T7/50 G06T2207/30148

    Abstract: There is provided a system and method of examining a specimen comprising a first layer and a second layer. The method comprises obtaining a recipe including a template image for each reference polygon in a reference image and a template mask indicative of proximity of a set of locations in the template image to an edge of the reference polygon; obtaining an inspection image in runtime; identifying first inspection polygons in the inspection image corresponding to the first reference polygons using template images and template masks thereof; determining a first shift for the first layer based on the first locations, and registering the first reference polygons with the inspection image based on the first shift. Similarly, a second shift for the second layer can be determined, and the second reference polygons can be registered with the inspection image based on the second shift.

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