公开(公告)号：US20220012852A1

公开(公告)日：2022-01-13

申请号：US16922972

申请日：2020-07-07

Applicant: Applied Materials Israel Ltd.

Inventor： Yehuda COHEN ,  Rafael BISTRITZER

IPC: G06T5/00 ,  G06T7/00 ,  G06T7/70

Abstract: There is provided a method and a system configured to compensate for image distortions.

公开(公告)号：US20220012861A1

公开(公告)日：2022-01-13

申请号：US16922977

申请日：2020-07-07

Applicant: Applied Materials Israel Ltd.

Inventor： Yehuda COHEN ,  Rafael BISTRITZER

IPC: G06T7/00 ,  G06K9/62

Abstract: There is provided a method and a system configured obtain an image of a semiconductor specimen including one or more arrays, each including repetitive structural elements, and one or more regions, each region at least partially surrounding a corresponding array and including features different from the repetitive structural elements, wherein the PMC is configured to, during run-time scanning of the semiconductor specimen, perform a correlation analysis between pixel intensity of the image and pixel intensity of a reference image informative of at least one of the repetitive structural elements, to obtain a correlation matrix, use the correlation matrix to distinguish between one or more first areas of the image corresponding to the one or more arrays and one or more second areas of the image corresponding the one or more regions, and output data informative of the one or more first areas of the image.

公开(公告)号：US20230230349A1

公开(公告)日：2023-07-20

申请号：US18125695

申请日：2023-03-23

Applicant: Applied Materials Israel Ltd.

Inventor： Yehuda COHEN ,  Rafael BISTRITZER

IPC: G06V10/762 ,  G06T7/00 ,  G06F18/23

CPC classification number: G06V10/762 ,  G06T7/001 ,  G06F18/23 ,  G06T2207/30148

Abstract: There is provided a method and a system configured obtain an image of a semiconductor specimen including one or more arrays, each including repetitive structural elements, and one or more regions, each region at least partially surrounding a corresponding array and including features different from the repetitive structural elements, wherein the PMC is configured to, during run-time scanning of the semiconductor specimen, perform a correlation analysis between pixel intensity of the image and pixel intensity of a reference image informative of at least one of the repetitive structural elements, to obtain a correlation matrix, use the correlation matrix to distinguish between one or more first areas of the image corresponding to the one or more arrays and one or more second areas of the image corresponding the one or more regions, and output data informative of the one or more first areas of the image.