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公开(公告)号：US20190335621A1
公开(公告)日：2019-10-31
申请号：US16466471
申请日：2017-12-07
Applicant: Aptiv Technologies Limited
Inventor： Grzegorz Szostek , Marcin Hyrlicki , Krzysztof Adamczyk , Pawel Brache
Abstract: A heat dissipation device comprises a generally rectangular metal cooling plate; the metal plate comprises, on its upper face, first attachment means for attaching a first printed circuit board, which means are provided for bringing at least one heat-generating zone of the first printed circuit board to bear with the upper face of the plate; the metal plate comprises, on its lower face, second attachment means for attaching a second printed circuit board, which means are provided for bringing at least one heat-generating zone of the second printed circuit board to bear with the lower face of the plate.
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