公开(公告)号：US20230039529A1

公开(公告)日：2023-02-09

申请号：US17392984

申请日：2021-08-03

Applicant: Aptiv Technologies Limited

Inventor： Jun Yao ,  Roberto Leonardi ,  Dennis C. Nohns ,  Ryan K. Rossiter

IPC: H01P5/04 ,  H01P3/12

Abstract: This document describes techniques, apparatuses, and systems utilizing a high-isolation transition design for differential signal ports. A differential input transition structure includes a first layer and a second layer made of a conductive metal and a substrate positioned between the first and second layers. The second layer includes a first section that electrically connects to a single-ended signal contact point and to a first contact point of a differential signal port. The first section includes a first stub based on an input impedance of the single-ended signal contact point and a second stub based on a differential input impedance associated with the differential signal port. The second layer includes a second section that electrically connects to a second contact point of the differential signal port and to the first layer through a via housed in a pad. The second section includes a third stub associated with the differential input impedance.

公开(公告)号：US20230187804A1

公开(公告)日：2023-06-15

申请号：US18164790

申请日：2023-02-06

Applicant: Aptiv Technologies Limited

Inventor： Jun Yao ,  Roberto Leonardi ,  Dennis C. Nohns ,  Ryan K. Rossiter

IPC: H01P5/10 ,  H01P3/12 ,  H01P5/04

CPC classification number: H01P5/10 ,  H01P3/121 ,  H01P5/04

Abstract: This document describes techniques, apparatuses, and systems utilizing a high-isolation transition design for differential signal ports. A differential input transition structure includes a first layer and a second layer made of a conductive metal and a substrate positioned between the first and second layers. The second layer includes a first section that electrically connects to a single-ended signal contact point and to a first contact point of a differential signal port. The first section includes a first stub based on an input impedance of the single-ended signal contact point and a second stub based on a differential input impedance associated with the differential signal port. The second layer includes a second section that electrically connects to a second contact point of the differential signal port and to the first layer through a via housed in a pad. The second section includes a third stub associated with the differential input impedance.

公开(公告)号：US11616282B2

公开(公告)日：2023-03-28

申请号：US17392984

申请日：2021-08-03

Applicant: Aptiv Technologies Limited

Inventor： Jun Yao ,  Roberto Leonardi ,  Dennis C. Nohns ,  Ryan K. Rossiter

IPC: H01P5/10 ,  H01P3/12 ,  H01P5/04

Abstract: This document describes techniques, apparatuses, and systems utilizing a high-isolation transition design for differential signal ports. A differential input transition structure includes a first layer and a second layer made of a conductive metal and a substrate positioned between the first and second layers. The second layer includes a first section that electrically connects to a single-ended signal contact point and to a first contact point of a differential signal port. The first section includes a first stub based on an input impedance of the single-ended signal contact point and a second stub based on a differential input impedance associated with the differential signal port. The second layer includes a second section that electrically connects to a second contact point of the differential signal port and to the first layer through a via housed in a pad. The second section includes a third stub associated with the differential input impedance.