公开(公告)号：US20030106377A1

公开(公告)日：2003-06-12

申请号：US10315934

申请日：2002-12-11

Applicant: Asmo Co., Ltd.

Inventor： Hidenori Ishihara ,  Hirokazu Tsuda ,  Manabu Kato

IPC: G01L007/00

CPC classification number: E05F15/44 ,  H01H1/58 ,  H01H3/142

Abstract: According to a pressure sensitive sensor and a method of treating a terminal of a pressure sensitive sensor of the invention, a covering portion is formed by a thermoplastic resin material for hot melt molding or a photo-curing resin material cured by absorbing light energy. That is, molding pressure in molding is lower than molding pressure in molding by a general injection molding method. Therefore, a possibility of effecting adverse influence on respective connecting portions of an electrode line, a resistor, a conductive piece and a lead wire by the molding pressure is extremely low and disconnection caused by operating the molding pressure on the connecting portions can reliably be prevented.