WIRE ELECTRIC-DISCHARGE MACHINING DEVICE, WIRE ELECTRIC-DISCHARGE MACHINING METHOD, THIN-PLATE MANUFACTURING METHOD, AND SEMICONDUCTOR WAFER MANUFACTURING METHOD
    3.
    发明申请
    WIRE ELECTRIC-DISCHARGE MACHINING DEVICE, WIRE ELECTRIC-DISCHARGE MACHINING METHOD, THIN-PLATE MANUFACTURING METHOD, AND SEMICONDUCTOR WAFER MANUFACTURING METHOD 有权
    电线放电加工装置,电力放电加工方法,薄板制造方法和半导体制造方法

    公开(公告)号:US20140332503A1

    公开(公告)日:2014-11-13

    申请号:US14364188

    申请日:2012-12-17

    IPC分类号: B23H7/06 B23H7/10

    摘要: A wire electric-discharge machining device includes a control unit that selects a cutting wire to which a pulse voltage is applied by a pulse-voltage generation unit on a basis of an angle formed between an end face of a workpiece and a plane including a plurality of cutting wires, which are not parallel to the end face, an interval between parallel cutting wires, and a relative distance between the cutting wires and the workpiece. A drive unit drives a workpiece in a direction not vertical to the plane including the cutting wires, and the workpiece is cut by electric-discharge machining by applying a pulse voltage.

    摘要翻译: 线放电加工装置包括:控制单元,其基于在工件的端面和包括多个的工件的平面之间形成的角度来选择由脉冲电压产生单元施加脉冲电压的切割线 切割线不平行于端面,平行切割线之间的间隔以及切割线和工件之间的相对距离。 驱动单元在不垂直于包括切割线的平面的方向上驱动工件,并且通过施加脉冲电压通过放电加工来切割工件。

    WORKPIECE RETAINER, WIRE ELECTRIC DISCHARGE MACHINING DEVICE, THIN-PLATE MANUFACTURING METHOD, AND SEMICONDUCTOR-WAFER MANUFACTURING METHOD
    4.
    发明申请
    WORKPIECE RETAINER, WIRE ELECTRIC DISCHARGE MACHINING DEVICE, THIN-PLATE MANUFACTURING METHOD, AND SEMICONDUCTOR-WAFER MANUFACTURING METHOD 有权
    工作保持器,电线放电加工装置,薄板制造方法和半导体制造方法

    公开(公告)号:US20130043217A1

    公开(公告)日:2013-02-21

    申请号:US13695716

    申请日:2011-03-23

    IPC分类号: B23H1/00

    CPC分类号: B23H11/003 B23H7/02 B23H9/00

    摘要: A workpiece retainer retains a workpiece at a time of a cutting process by a wire electric discharge machining device that cuts a workpiece by electric discharge from wire electrodes that are spaced from each other and are arranged in parallel. The workpiece retainer is formed with a fitting portion, into which the workpiece is fitted substantially without any gap, and has an external shape such that at a time of cutting the workpiece retainer together with the workpiece fitted in the fitting portion, a length along the wire electrodes of a portion where the workpiece retainer and the workpiece face the wire electrodes becomes substantially constant during the cutting process of the workpiece.

    摘要翻译: 工件保持器通过线电火花加工装置在切割加工时保持工件,该线材放电加工装置通过从彼此间隔开并且平行布置的线电极放电而切割工件。 工件保持器形成有嵌合部,工件基本上没有任何间隙地装配在该嵌合部中,并且具有外部形状,使得在与被安装在装配部中的工件一起切割工件保持器时,沿着 工件保持器和工件面对线电极的部分的线电极在工件的切割过程中变得基本恒定。

    WIRE DISCHARGE MACHINING APPARATUS AND MANUFACTURING METHOD FOR SEMICONDUCTOR WAFERS USING THE SAME
    7.
    发明申请
    WIRE DISCHARGE MACHINING APPARATUS AND MANUFACTURING METHOD FOR SEMICONDUCTOR WAFERS USING THE SAME 审中-公开
    使用它的半导体波导的排线加工设备和制造方法

    公开(公告)号:US20150053650A1

    公开(公告)日:2015-02-26

    申请号:US14390189

    申请日:2012-10-19

    IPC分类号: B23H7/10 B23H9/00 B23H1/02

    摘要: A wire discharge machining apparatus including a plurality of main guide rollers disposed in parallel at intervals, one wire that is wound between the guide rollers while being spaced apart from one another at a fixed pitch to form cutting wire sections between a pair of guide rollers and travels according to the rotation of the main guide rollers, and power feed terminal units that feed electric power to wires of the cutting wire sections. The wire discharge machining apparatus performs cutting of a work piece with the cutting wire sections, suspends cut-out of semiconductor wafers from the work piece in a state in which a part of the semiconductor wafers is connected to the work piece, brings the wires of the cutting wire sections close to one cut surfaces, and scans the cut surfaces in a discharge-machined state.

    摘要翻译: 一种线排出加工装置,包括多个平行间隔布置的主引导辊,一个线以相互间隔彼此间隔的方式缠绕在导向辊之间,形成一对导辊之间的切割线部分, 根据主导辊的旋转运动,以及向切割线部分的电线供电的供电端子单元。 线排出加工装置在切割线部分切割工件,在半导体晶片的一部分连接到工件的状态下将工件的半导体晶片切断,使线 切割线部分靠近一个切割表面,并且在放电加工状态下扫描切割表面。

    ELECTRICAL DISCHARGE MACHINING APPARATUS AND ELECTRICAL DISCHARGE MACHINING METHOD
    8.
    发明申请
    ELECTRICAL DISCHARGE MACHINING APPARATUS AND ELECTRICAL DISCHARGE MACHINING METHOD 审中-公开
    电动放料加工设备和放电加工方法

    公开(公告)号:US20120312787A1

    公开(公告)日:2012-12-13

    申请号:US13579970

    申请日:2011-03-29

    IPC分类号: B23H7/02 B23H7/10

    CPC分类号: B23H7/02 B23H7/107 B23H7/14

    摘要: An electrical discharge machining apparatus includes a machining electrode that is one wire and includes a plurality of opposing sections with respect to a workpiece by being wound around a plurality of guide rollers, driving units that change a relative distance between the workpiece and the opposing sections, and a plurality of pulse generating units that apply electrical discharge machining pulses between the workpiece and the opposing sections, respectively, in which the pulse generating units are controlled such that application start times of electrical discharge machining pulses for adjacent opposing sections do not coincide with each other.

    摘要翻译: 放电加工装置包括:加工电极,其是一根线,并且通过围绕多个引导辊缠绕相对于工件的多个相对部分,所述驱动单元改变所述工件和所述相对部分之间的相对距离, 以及多个脉冲发生单元,其分别在工件和相对部分之间施加放电加工脉冲,其中脉冲发生单元被控制,使得相邻相对部分的放电加工脉冲的施加开始时间不与每个 其他。