公开(公告)号：US20220367334A1

公开(公告)日：2022-11-17

申请号：US17737903

申请日：2022-05-05

申请人： Avago Technologies International Sales Pte. Limited.

发明人： Wen-Hsien HUANG ,  Kwok Cheung TSANG

IPC分类号： H01L23/498 ,  H01L23/00 ,  H01L21/48

摘要： One or more implementations of the subject technology may enable a bond-on-pad (BoP) substrate technology that can eliminate the need to utilize a solder-on-pad (SoP) process. Unlike an SoP process, a BoP Process does not require a solder bump to be formed on a bump pad to attach a joint to a bump pad. The size of an opening on a bump pad for a BoP process may be larger than that of an SoP process. A BoP process may use a solder mask having multiple thicknesses and may be thinner near the bump pads. A BoP process may use a joint having a copper pillar and a solder cap. A BoP process can be used with an underfill or a molding compound technology.