Thermoplastic compounds bondable to rigid substrates

    公开(公告)号:US11535743B2

    公开(公告)日:2022-12-27

    申请号:US16978367

    申请日:2019-03-05

    Abstract: Thermoplastic compounds include elastomer, modified polyolefin polymer including a polar functional group, and unmodified polyolefin polymer. The melt flow rate of the modified polyolefin polymer is greater than the melt flow rate of the unmodified polyolefin polymer. The thermoplastic compounds exhibit excellent bonding when overmolded onto rigid substrates such as metals, while also providing desirable aesthetic properties and good processability.

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