公开(公告)号：US20210345529A1

公开(公告)日：2021-11-04

申请号：US17285699

申请日：2019-10-14

Applicant: Avient Corporation

Inventor： Raul JUAN ,  Javier PUYALTO ,  Renlong GAO ,  David SANCHEZ

IPC: H05K9/00

Abstract: Thermoplastic compounds in the form of a pellet include thermoplastic resin and conductive fibers. The conductive fibers are enveloped by the thermoplastic resin and distributed within the pellet such that each of at least a portion of the conductive fibers is substantially surrounded by the thermoplastic resin and thereby substantially separated from physical contact with any other of the conductive fibers. Additionally, at least a portion of the conductive fibers includes long fibers. The thermoplastic compound, when molded at a thickness of about 3.2 mm, has an electromagnetic shielding effectiveness across a range of frequencies from about 0.5 GHz to about 2.0 GHz of at least about 60 dB according to ASTM D4935, which makes the thermoplastic compound useful for molding thermoplastic articles for shielding against electromagnetic interference.