公开(公告)号：US20250001673A1

公开(公告)日：2025-01-02

申请号：US18749846

申请日：2024-06-21

Applicant: Azalea Vision BV

Inventor： Andrés Vásquez Quintero

IPC: B29C51/46 ,  B29C51/02 ,  B29C51/14 ,  B29K21/00 ,  B29K105/20 ,  B29L11/00 ,  G06F30/10 ,  G06F113/22

Abstract: A method for designing a flat device to be thermoformed into a shape-retaining non-flat device using a mold is provided. The flat device comprises two concentric annular layers: a carrier layer, having an outer radius (RCout) and a carrier layer width (WC); and a support layer having a support layer width (WS). The support layer is mechanically attached to the carrier layer wherein an inner distance (GAP) is formed between an inner edge of the carrier layer and an inner edge of the support layer. The method comprises obtaining predetermined values for the outer radius of the carrier layer, the support layer width and the inner distance, obtaining a geometry of the mold, and obtaining material properties of the support layer and the carrier layer. The method further comprises performing at least two simulations of thermoforming a simulated flat device into a non-flat device using the mold, based on the obtained predetermined values, material properties, and geometry of the mold for at least two different carrier layer widths. The method further comprises determining a circumferential strain at an outer edge of the support layer in each of the simulated non-flat devices. The method further comprises determining, based on the determined circumferential strains, a linear relation between the circumferential strain and a dimension ratio defined by ratio = ( W C - ( W S + GAP ) ) / R Cout . The method further comprises determining (1070), based on the determined linear relation, a value (ratioMNB) of the dimension ratio for which the strain is zero and determining, from the dimension ratio for which the strain is zero, the width of the carrier layer in the flat device as W C = ratio * R Cout + W S + GAP .