公开(公告)号：US20240332771A1

公开(公告)日：2024-10-03

申请号：US18130077

申请日：2023-04-03

Applicant: BAE SYSTEMS Information and Electronic Systems Integration Inc.

Inventor： Mark D. Hickle ,  Gregory M. Flewelling ,  Kim Eilert

IPC: H01P1/208 ,  H01P1/205 ,  H01P7/08

CPC classification number: H01P1/2084 ,  H01P1/2053 ,  H01P7/088

Abstract: An apparatus includes a lower plate, an upper plate above the lower plate, and a plurality of vias extending from the lower plate to the upper plate. The lower plate, the upper plate, and the plurality of vias include conductive material. A post including conductive material extends from the lower plate and towards the upper plate. An inner plate including conductive material is above and in contact with the post, where the post and the inner plate are separated from the upper plate by dielectric material. The plurality of vias are arranged to at least in part wrap around the post. A signal line extends between the lower and upper plates and at least in part wraps around the post, where the signal line extends through an opening between a first via and a second via of the plurality of vias. In an example, the apparatus is a resonator structure.