公开(公告)号：US20210193586A1

公开(公告)日：2021-06-24

申请号：US16718586

申请日：2019-12-18

Applicant: BAE SYSTEMS Information and Electronic Systems Integration Inc.

Inventor： Roman KHAZANOVICH ,  David C. RINGLEN

IPC: H01L23/552 ,  H01L23/498 ,  H01L23/31 ,  H01L25/18

Abstract: A Cryptographic System-in-Package (CSiP) including a built in TEMPEST shield surrounding the sides and the top of the device. In some cases the TEMPEST shield is metal and acts as a thermal path to conduct heat off of the CSiP. In some cases, the TEMPEST shield comprises a microscopic wire mesh and/or includes a power supply filter to block information leakage on the input voltage pins, a ball grid array (BGA) with ground encompassing the full perimeter the bottom of the package, and an encapsulation layer.

公开(公告)号：US20210191503A1

公开(公告)日：2021-06-24

申请号：US16720130

申请日：2019-12-19

Applicant: BAE SYSTEMS Information and Electronic Systems Integration Inc.

Inventor： Roman KHAZANOVICH

IPC: G06F1/3296 ,  G06F21/60 ,  G06F13/40

Abstract: The system and method of externally powered cold key load injects a voltage into a cryptographic computer without disturbing any data pins. There are several mechanical approaches that are viable, a Y cable implementation, a two cable solution, a direct connect solution, and more. The system includes the ability to provide a variable voltage power source to the cryptographic computer.