公开(公告)号：US20230089340A1

公开(公告)日：2023-03-23

申请号：US17795912

申请日：2020-01-30

申请人： BARCO N.V.

发明人： Zhi Qiang FANG ,  Alexander VON PONCET ,  Bart MALFAIT ,  Wouter Maurice S JANSSENS

IPC分类号： G02B7/18 ,  G02B26/08 ,  F28D15/02

摘要： A cooling sub-assembly for cooling a heat dissipating electronic device. The sub-assembly may include a vapor chamber, a peltier element and a coldplate placed on top of each other forming a stack such that the peltier element is sandwiched between the vapor chamber and the coldplate. The vapor chamber has a head facing the peltier element, a foot for facing the heat dissipating electronic device, and a wall extending between the foot and the head. The area of the head is larger than the area of the foot.