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公开(公告)号：US20220340752A1
公开(公告)日：2022-10-27
申请号：US17619758
申请日：2020-06-23
Applicant: BASF SE
Inventor： Jens Cremer , Andre Schaefer , Tsung-Chie Cheng , Boris Weber
Abstract: Described herein is a thermoplastic molding composition, including A) from 10 to 60% by weight of a thermoplastic semicrystalline polyamide-6, B) from 5 to 50% by weight of a thermoplastic semiaromatic semicrystalline polyamide containing repeating units of hexamethylenediamine and terephthalic acid, C) from 10 to 65% by weight of fibrous and/or particulate fillers, and D) from 0 to 30% by weight of further additives, where the total of the percentages by weight of components A) to D) is 100%.
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