公开(公告)号：US11528829B2

公开(公告)日：2022-12-13

申请号：US17624139

申请日：2020-06-30

申请人： BEIHANG UNIVERSITY ,  Weixing Yuan ,  Tongzhi Yang ,  Kexian Ren ,  Bo Yang ,  Ze Miao

发明人： Weixing Yuan ,  Tongzhi Yang ,  Kexian Ren ,  Bo Yang ,  Ze Miao

IPC分类号： H05K7/20

摘要： An overall efficient heat dissipation system for a high power density cabinet comprises a pump-driven two-phase circulation loop high-power-chip direct heat dissipation system and a cabinet air-cooling system. The cabinet air-cooling system comprises a refrigerant circulation loop and a cabinet internal air circulation loop. The refrigerant circulation loop includes a pump-driven two-phase circulation loop and a vapor compression circulation loop. The pump-driven two-phase circulation loop high-power-chip direct heat dissipation system performs fixed-point heat dissipation for main heating elements, such as CPU and GPU, in a server, and the cabinet air-cooling system performs air-cooling heat dissipation for other heating elements in the server.