公开(公告)号：US11301082B2

公开(公告)日：2022-04-12

申请号：US17242511

申请日：2021-04-28

申请人： BOE Technology Group Co., Ltd.

发明人： Wenqu Liu ,  Qi Yao ,  Feng Zhang ,  Zhao Cui ,  Libo Wang ,  Dongfei Hou ,  Xiaoxin Song ,  Zhijun Lv ,  Liwen Dong ,  Detian Meng ,  Jalil Ryu ,  Yang Yue ,  Haitao Huang

IPC分类号： G06F3/041 ,  G06F3/045 ,  G06F3/044 ,  G06K9/00

摘要： The present disclosure provides a fingerprint recognition unit and a fabrication method thereof, a fingerprint recognition module and a display device. The fingerprint recognition unit includes: a bearing substrate; a receiving electrode layer on the bearing substrate; a piezoelectric material layer on a side of the receiving electrode layer away from the bearing substrate; and a driving electrode layer on a side of the piezoelectric material layer away from the receiving electrode layer. A density of the driving electrode layer is greater than 5 g/cm3, and a thickness of the driving electrode layer, a thickness of the piezoelectric material layer and a thickness of the bearing substrate are configured such that a vibration nodal plane of the piezoelectric material layer is within the piezoelectric material layer.