公开(公告)号：US20190159343A1

公开(公告)日：2019-05-23

申请号：US15968860

申请日：2018-05-02

申请人： BOE Technology Group Co., Ltd. ,  Chengdu BOE Optoelectronics Technology Co., Ltd.

发明人： Fuzheng Xie ,  Junshuo Li ,  Binfeng Feng ,  Xiaoxia Liu ,  Meiling Piao

IPC分类号： H05K3/00 ,  H05K1/02

摘要： In one embodiment, a motherboard to be cut, includes: a motherboard body provided, on a surface thereof, with a cutting line comprising a special-shaped cutting line section, wherein, a plurality of positional marker groups are provided on a portion of the surface where the special-shaped cutting line section is provided; each positional marker group includes a first marker assembly and a second marker assembly provided at both sides of the special-shaped cutting line section; and, in the arrangement direction of the first marker assembly and the second marker assembly, size of the first marker assembly is not less than tolerance size of a side of the special-shaped cutting line section where the first marker assembly is in, and size of the second marker assembly is not less than tolerance size of a side of the special-shaped cutting line section where the second marker assembly is in.