公开(公告)号：US20190159352A1

公开(公告)日：2019-05-23

申请号：US16314362

申请日：2017-06-19

Applicant: BYD COMPANY LIMITED

Inventor： Jian SUN ,  Liang CHEN ,  Guiwang ZHAO ,  Yingyuan WU ,  Xiangrong JIANG ,  Yunfei ZOU

IPC: H05K5/02

Abstract: The present disclosure relates to the field of electronic communications, and discloses a housing, a preparation method therefor, and use thereof. The housing includes a metal hard anodic oxide layer (5) and a resin film layer (3) adhering to a first surface of the metal hard anodic oxide layer (5). The metal hard anodic oxide layer (5) and the resin film layer (3) form an integrated structure. The preparation method includes: performing hard anode oxidization treatment on a metal substrate (1), and then successively performing injection molding and etching.

公开(公告)号：US20190322077A1

公开(公告)日：2019-10-24

申请号：US16314358

申请日：2017-06-19

Applicant: BYD COMPANY LIMITED

Inventor： Jian SUN ,  Liang CHEN ,  Guiwang ZHAO ,  Shuai ZHU ,  Xiangrong JIANG

IPC: B32B15/08 ,  H05K5/02 ,  B32B15/20 ,  C25D11/16 ,  C25D11/24 ,  C23F1/02 ,  C23F17/00 ,  C25D11/08

Abstract: The present disclosure relates to the field of electronic communications, and discloses a housing, a preparation method therefor, and use thereof. The housing includes a metal anodic oxide layer (5) and a resin film layer (3) adhering to a first surface of the metal anodic oxide layer (5). The metal anodic oxide layer (5) and the resin film layer (3) form an integrated structure. The preparation method includes: performing anode oxidization treatment on a metal substrate (1), and then successively performing injection molding and etching.