公开(公告)号：US20200224030A1

公开(公告)日：2020-07-16

申请号：US16608649

申请日：2018-03-28

Applicant: BYD COMPANY LIMITED

Inventor： Qing GONG ,  Wei ZHOU ,  Xiong ZHANG ,  Yue YU ,  Renlan SHI

IPC: C08L81/02 ,  B32B15/09 ,  B29C45/14 ,  C08L67/02

Abstract: The present invention discloses a low-dielectric resin composition, a low-dielectric resin/metal composite material and a preparation method thereof, and an electronic device. The resin composition comprises, based on 100% by weight of the resin composition: 45-70 wt % of a base resin, 20-45 wt % of a chopped glass fiber, 1-3 wt % of a toughening resin, 0.2-0.5 wt % of an unmodified glycidyl methacrylate, and 0-10 wt % of an auxiliary. The base resin is selected from the PBT resin and/or the PPS resin. The chopped glass fiber has a dielectric constant of 4.0 to 4.4 at 1 MHz. With the same base resin component, the dielectric constant and dielectric loss of the low-dielectric resin material prepared with the low-dielectric resin composition are significantly reduced, which is advantageous for satisfying the requirements of use of plastics for antenna channels in metal shell of an electronic device, so as to improve the ability of the electronic device having antennas to receive and transmit signals.