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公开(公告)号：US20170138058A1
公开(公告)日：2017-05-18
申请号：US15347288
申请日：2016-11-09
Applicant: Badger Innovative Technologies, LLC
Inventor： Gary Swartz
IPC: E04F13/04
CPC classification number: E04F13/042
Abstract: A tape includes a paper substrate, and a coating of resin-remoistening adhesive on one surface of the paper substrate. The paper substrate defines a plurality of holes or interstices patterned longitudinally in a single line along or near a center line of the paper substrate. The tape is used for taping gaps, seams or joints between wallboard or drywall members, for example, for sealing a dry wall joint. Methods of making the tape and using the tape are also provided.
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