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公开(公告)号：US20140237213A1
公开(公告)日：2014-08-21
申请号：US13772260
申请日：2013-02-20
IPC分类号： G06F9/22
CPC分类号： G06F9/22 , G01T1/026 , G06F11/183 , G06F11/3006 , G06F11/3024 , G06F11/3058 , G06F11/3093
摘要： Described is a processor comprising: a plurality of radiation detectors; a first logic unit to receive outputs from the plurality of radiation detectors, the logic unit to generate an output according to the received outputs, the output of the first logic unit indicating whether the processor was exposed to incoming radiations; and a second logic unit to receive the output from the first logic unit, and to cause the processor to perform an action according to the output from the first logic unit.
摘要翻译： 描述了一种处理器，包括：多个辐射检测器; 第一逻辑单元，用于接收来自所述多个辐射检测器的输出，所述逻辑单元根据所接收的输出生成输出，所述第一逻辑单元的输出指示所述处理器是否暴露于进入的辐射; 以及第二逻辑单元，用于接收来自第一逻辑单元的输出，并且使得处理器根据来自第一逻辑单元的输出执行动作。
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公开(公告)号：US20200041910A1
公开(公告)日：2020-02-06
申请号：US16306399
申请日：2017-05-27
申请人： Bin WANG , Xiaofeng YANG , Hongfa XIA
发明人： Bin WANG , Xiaofeng YANG , Hongfa XIA
IPC分类号： G03F7/20
摘要： A shutter blade assembly for a photolithography machine, a large-field of view (FoV) photolithography machine and an exposure method are disclosed. A scan-ning-directional shutter blade subassembly is moved once during each illuminance test and then moved above alignment marks after the test. During exposure, the scanning-directional shutter blade subassembly moves with a mask stage in the same direction and at the same speed so that it stays stationary relative to the alignment marks on a photomask (4). In case of full-FoV exposure, it is not necessary for a non-scanning-directional shutter blade subassembly to be moved, while in case of partial-FoV exposure, it is moved into the partial exposure FoV and defines there a window for obtaining a light spot with a desired shape by modulating illumination light. After that, with the non-scanning-directional shutter blade subassembly being maintained stationary, the exposure FoV can be shifted from the current exposed region to a new region to be exposed simply by moving the mask and wafer stages. This process can be repeated until all the regions to be exposed have been exposed. Since the need for multiple shutter blade assemblies is dispensed with, structural simplification can be achieved, the requirements for control accuracy can be lowered.
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